PCBA proofing patch manufacturing steps:
First: PCB film generation
All copper and solder mask films are made of photo-exposed polyester film.
Second: PCB chooses Raw material
Industry standard 1.6mm thick FR-4 laminated copper clad on both sides. The size of the panel will fit multiple circuit boards.
Third: PCB drilling
The through holes required to create the PCB design come from the files you submit, using an NC drilling machine and a carbide drill
Fourth time: PCB electroless copper plating
In order for the vias to be electrically connected to different layers of the PCB, a thin copper layer is chemically deposited in the vias. This copper will then be thickened by electrolytic copper plating (step 6).
Fifth: PCB application photoresist and image
In order to transfer the PCBA proofing patch design from the electronic CAD data to the physical circuit board, we first apply photosensitive photoresist to the panel to cover the entire circuit board area. Then the copper layer film image (step 1) is placed on the board, and the high-intensity UV light source exposes the uncovered part of the photoresist. Then we chemically develop the circuit board (remove the unexposed photoresist from the panel), forming pads and traces
Sixth: PCB pattern board
This step is an electrochemical process that establishes copper thickness in the holes and on the surface of the PCB. Once the copper thickness is formed in the circuits and holes, we will plate an additional layer of tin on the exposed surface. The tin will protect the copper plating during the etching process (step 7) and will then be removed.
Article 7: PCB strip& PCB etching
This process is carried out in multiple steps. The first is the chemical removal (stripping) of the photoresist from the panel. The newly exposed copper is then chemically removed (etched) from the panel. The tin applied in step 6 protects the required copper circuits from being etched. At this point, the basic circuit of the PCB is defined. Finally, the tin protection layer is chemically removed (stripped) to expose the copper circuit.
8th time: PCB solder mask
Next, we coat the entire panel with a liquid solder mask. Using thin film and high-intensity UV light (similar to step 5), we exposed the solderable area of the PCB. The main function of the solder mask is to protect most copper circuits from oxidation, damage and corrosion, and to maintain circuit isolation during assembly.
Page 9: PCB legend (screen printing)
Next, we print the reference signs, logos and other information contained in the electronic file onto the panel. This process is very similar to the inkjet printing process, but specifically for PCB design
10th time: PCB surface treatment
Finally, the surface finish is then applied to the panel. This surface treatment (tin/lead solder or immersion silver, gold plating) is used to protect the copper (soldering surface) from oxidation and is used as a component to be soldered to the PCB position.
11th time: PCB test
The process of PCB testing is to use jigs or flying probes for circuit testing and inspection of OK and NG products.
This is the manufacturing process of single-sided PCB and double-sided PCB circuit boards, and the manufacturing of multi-layer PCB boards will be more complicated. Need to press lamination.
After 11 PCB manufacturing steps, we will perform 100% electronic circuit testing on your PCB board.