The assembly method of PCB prototype patch manufacturers
- 2020-05-23-

The assembly method of PCB prototype patch manufacturers

PCB model patchThe manufacturer's electronic component assembly technology involves a very wide range of knowledge. For example: manufacturing and assembly technology of electronic components, circuit design, welding technology, selection of mounting materials, etc.; in addition, it is also necessary to master the technology of cleaning, testing and maintenance of components. At present, the main assembly methods of PCB prototype SMT manufacturers are:


Full surface assembly. The full-surface assembly method of PCB prototype patch manufacturers refers to the assembly of all components on the PCB board, no matter whether the board is single-sided or double-sided. This component assembly method has the characteristics of simple process, small size, light weight of assembly parts and high assembly density. It is an assembly method that is currently used more in PCB sample chip manufacturers.

Single-sided mixed assembly. In the single-sided hybrid assembly method of PCB prototype patch manufacturers, as the name implies, it refers to the mode of mixed assembly of patch components and plug-in components on a single side of the PCB board. This kind of component assembly method is more complicated because some components are through-hole plug-in type. It is generally used in the assembly of relatively special electronic products in PCB sample chip manufacturers.

Double-sided mixed assembly. The double-sided mixed assembly of PCB sample board manufacturers includes two situations: one is in the PCB board, the components on one side are welded and assembled by the plug-in method; the other side is welded and assembled by the SMT mounting method; the other is in the PCB The components used on each side of the board include both patch components and plug-in components. The welding position of the patch component is on the same side as the component, and the welding position of the plug-in component is on the back of the component. Therefore, this assembly method has extremely high requirements on the craftsmanship of the PCB sample chip manufacturer.