Talking about the via process of PCB template punching
- 2020-05-15-

Talking about the via process of PCB template punching

inPCB model makingThe via process is a very important part of the manufacturer's component insertion process. Under normal circumstances, the insertion of components must be through-hole technology, otherwise the subsequent component insertion process cannot be carried out, and the cost of punching on the PCB board accounts for 30% of the cost of the entire PCB prototype. About 40%, it can be said to be very expensive. The via process is generally divided into three types according to the process technology, namely blind via, buried via, and via.


In the PCB prototype board manufacturers, the through hole refers to a type of hole that penetrates the front and back of the PCB board, through which the components can realize the electrical interconnection between the components and the inside of the PCB board. At present, most of the PCB boards on the market use the through-hole method for component insertion. This is because the through-hole process is relatively mature and easier to implement among PCB prototype manufacturers, and the product yield rate is high, and The manufacturing cost is relatively low compared to the blind via and buried via process.

In the PCB prototype board manufacturers, blind holes generally refer to the holes on the top or bottom surface of the PCB board that do not penetrate the entire PCB board. The depth of the blind hole generally does not exceed the corresponding regulations, and the plug-in components are connected to the surface circuit and the inner circuit of the PCB board through such non-through holes. The buried hole refers to the connection hole located in the inner layer of the PCB. From the surface, no holes can be seen at all. Since these two types of holes exist in the inner layer of the PCB board, the PCB template punching manufacturer needs to use the through-hole forming process to achieve the punching, and if necessary, it needs to be more in the PCB board. Make the inner layer to realize the connection of the line. Although the blind hole and buried hole process can improve electromagnetic compatibility, reduce the size and weight of the PCB board, and reduce the production cost. However, in the process of making PCB prototypes, these two processes are relatively complicated and difficult, and the yield of products is low, which also leads to very expensive processes. Therefore, these two types of holes are compared in practical applications. less.