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Types of SMT Technology in SMT Proofing and Trial Production
- 2020-04-17-

Types of SMT Technology in SMT Proofing and Trial Production

SMT Proofing Trial ProductionThe manufacturer's SMT technology involves a very wide range of knowledge. For example: manufacturing and assembly technology of electronic components, circuit design, welding technology, selection of mounting materials, etc.; in addition, it is also necessary to master the technology of cleaning, testing and maintenance of components. In SMT proofing trial production manufacturers, SMT technology can be divided into:

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Full surface assembly. The full-surface assembly method of SMT proofing trial manufacturers means that all components are assembled on the PCB board, regardless of the single-sided or double-sided of the board. This component assembly method has the characteristics of simple process, small size, light weight of assembly parts and high assembly density. It is a type of SMT patch technology that is currently used more in SMT proofing trial production manufacturers.

Single-sided mixed assembly. The single-sided hybrid assembly method of the SMT proofing trial production manufacturer, as the name suggests, refers to the mixed assembly mode of SMT components and plug-in components on a single side of the PCB board. This kind of component assembly method is more complicated because some components are through-hole plug-in type. In SMT proofing trial production manufacturers, it is generally used in relatively special electronic products.

Double-sided mixed assembly. The double-sided mixed assembly of SMT proofing trial production manufacturers includes two situations: one is in the PCB board, the components on one side are welded and assembled by inserting; the other side is welded and assembled by SMT patch technology; The components used on each side of the board include both patch components and plug-in components. The welding position of the patch component is on the same side as the component, and the welding position of the plug-in component is on the back of the component. Therefore, this assembly method requires SMT proofing and trial production manufacturers to have a very high level of technology.

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