Reflow soldering process of SMT chip proofing manufacturers
- 2020-03-31-

Reflow soldering process of SMT chip proofing manufacturers

SMT patch proofingAfter the manufacturer completes the component placement work, the relevant staff must do a good job of checking the placement accuracy and the correctness of the direction, and then place the printed board on the conveyor belt of the reflow oven. For the reflow soldering process, the key to soldering lies in the proper control of temperature and time. The reflow soldering process of SMT chip proofing manufacturers mainly includes the following aspects:


The first is preheating and heat preservation. SMT patch proofing manufacturers carry out heat treatment on the PCB, first place it in the preheating temperature zone environment, heat it until its temperature reaches 150-170 degrees Celsius, and then immediately heat it up. The main purpose of this is to Keep the temperature of the components in a more reliable state, so that SMT patch proofing manufacturers can well control the temperature difference between all components, greatly reduce the incidence of excessive temperature difference, and help keep the temperature of the circuit board in a balanced state .

The second is the reflux heating link. The SMT patch proofing manufacturer will ensure that the temperature of the component surface does not exceed the peak temperature tolerance of the component, and then increase the temperature increase speed of all components so that it can reach the peak temperature in a short time, and then the SMT patch proofing manufacturer The PCB board is transported out of the furnace with the help of a conveyor belt and placed in a cooling environment to accelerate its cooling.

The third is the welding link. During the PCB heating process, the SMT chip proofing manufacturer will use proper heating to help the solder material in it melt, and make it very fully wetted, and then the soldering work can be carried out on the surface of the PCB board for natural cooling treatment. After being completely cooled, solder joints will appear on the PCB. These solder joints have a good shape and are very bright. Since reflow soldering has very high requirements for environmental humidity, if the humidity exceeds 75%, white corrosion products will inevitably appear at the metal parts and their pins. Therefore, SMT patch proofing manufacturers will strictly control the reflow soldering process. In order to ensure the quality of welding.