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Unusual problem of PCB prototype welding
- 2020-01-30-

Because the product functions are becoming more and more powerful, the component body specifications are getting smaller and smaller, the product layout is getting more and more dense, and the defective products are becoming more and more difficult to repair. People have higher and higher product quality requirements; in order to save costs, the product quality is in line with Harmony and efficiency are designed and made, instead of what people often say that the product is checked out (misconception), why is it not checked out by visual inspection? It is rarely said why so many bad products are produced? How can we not produce Bad? It can reduce or avoid missed inspections, reduce customer complaints, and improve reputation.

If there is no quality assurance of the corresponding PCB prototype board-making and welding process, then any well-designed electronic device can hardly reach the design index. Therefore, the solder joints must be strictly inspected during soldering to avoid the occurrence of unqualified solder joint quality problems leading to unqualified electronic products. Let me introduce to you the problem of welding defects in various electronic PCB prototypes.

PCB样板打板焊接异常问题

First of all, after the PCB prototype welding operation is completed, in order to make the product have reliable performance, the welding quality work must be inspected. Welding inspection is generally a visual inspection, not only to inspect the solder joints, but also to check the conditions around the solder joints, such as problems arising from welding. The inspection of terminal wiring welding is to check from the welding state, check whether the insulation skin of the wire used is damaged, whether the terminal has scars; the degree of bending and tightness of the hook-welded wire hook, and whether there are dirty spots in each part Wait. Many of the performance damages of electronic components found in the electrical performance inspection are caused by poor soldering. Ultimately, the soldering of electronic products is mainly used for electrical connections. If there is a problem with a product with a defective electrical connection, it must be repaired to eliminate the defect.

In order to realize the portability of electronic products, many electronic factories will use PCB template-making processing technology, which can paste low-quality components on the circuit board, and the assembly efficiency is very high. The most important part of the PCB template-making technology is welding. If the welding is accurate and in place, the product quality will be very good. Let's take a look at what problems should be paid attention to when PCB prototypes are welded.

The temperature problem of the soldering iron head of the PCB sample board-making the soldering iron head of different temperature on the rosin block will produce different phenomena when the PCB sample board is soldered. Therefore, we must keep it at a suitable temperature, usually at a suitable temperature. The temperature at which the rosin melts quickly and does not smoke is the most suitable. PCB prototype welding time: The PCB prototype welding time should be controlled as accurately as possible. Generally, it is required to complete within a few seconds from heating the solder joint to the solder melting and filling the solder joint. In order to avoid the time is too long, the flux on the solder joints will completely volatilize, and finally lose the effect of soldering, or because the time is too short, the temperature of the solder joints will not reach the soldering temperature, so that the solder cannot be fully melted, and there is only a small amount of the solder joints. The tin soldering will cause poor contact, and the phenomenon of false soldering that is always on and off.

Pay attention to the amount of solder and flux used when making PCB prototypes-both solder and flux are indispensable materials in soldering. Reasonable selection of solder and flux is an important part of ensuring soldering quality. The use of solder and flux should also be controlled. Too much will cause the solder joints to be thick and even short-circuit with the nearby circuit. It may also cause short-circuits in other parts due to the dripping of the solder during the process of moving the soldering iron. Cover the solder joints and affect the firmness of the soldering.

During the soldering process of PCB prototype boarding, you also need to be careful not to touch the solder joints, especially when the solder on the solder joints has not completely solidified. Deformation will also produce a virtual welding phenomenon, which will affect the welding effect.