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Development of quality control standards for sample patches
- 2020-01-30-

In order to ensure the normal progress of the R&D model placement equipment, the setting of the production process control points must strengthen the quality inspection of the processed workpieces in each process to monitor its operating status. Therefore, it is necessary to set up quality control points after some key processes, so that quality problems in the previous process can be found and corrected in time, to prevent unqualified products from entering the next process, and reduce the economic loss caused by quality to a smaller extent. The setting of the quality control points is related to the production process. The IC card we produce is a single-sided paste-insertion mixed board, using the production process flow of first paste and then insert, and the following quality control points are added to the production process.

研发样板贴片的质量控制标准

1) Baking board inspection content

a. Whether the printed board is deformed;

b. Whether the pad is oxidized;

c. Whether there are scratches on the surface of the printed board;

Inspection method: visual inspection according to inspection standards.

2) Screen printing inspection content

a. Whether the printing is complete;

b. Whether there is bridging;

c. Whether the thickness is uniform;

d. Whether there is a sag;

e. Whether there is any deviation in printing;

Inspection method: visual inspection according to inspection standards or inspection with magnifying glass.

3) Patch inspection content

a. The placement position of the component;

b. Whether there is a film drop;

c. Whether there are any errors;

Inspection method: visual inspection according to inspection standards or inspection with magnifying glass.

4) Reflow soldering inspection content

a.The soldering conditions of the components, whether there are bad soldering phenomena such as bridges, tombstones, dislocations, solder balls, and virtual soldering.

b. The condition of the solder joints. Inspection method: visual inspection according to the inspection standard or inspection with the help of a magnifying glass.

5) Plug-in detection content

a. Whether there are missing parts;

b. Whether there are any errors;

C. Insertion of components;

Inspection method: visual inspection according to inspection standards.

Setting of quality process control points

The formulation of inspection standards Each quality control point should have corresponding inspection standards, including inspection objectives and inspection content, and quality inspectors should strictly follow the inspection standards to carry out their work.

If there is no inspection standard or incomplete content of the R&D model patch, it will bring considerable trouble to the production quality control. For example, when it is judged that the component is misaligned, how much deviation is considered unqualified? Quality inspectors often judge based on their own experience, which is not conducive to the uniformity and stability of product quality.

When developing the quality inspection standards for each process in the research and development of the sample patch, all defects should be listed as far as possible according to the specific situation, and the method of illustration should be used to facilitate the quality inspection and comparison. For example, Table 1 is the inspection standard for solder ball defects after reflow soldering. Defect type Defect content for example, the size of the solder ball is more than 1/2 of the lead pitch or greater than 0.3mm, even if it is less than 1/2 of the lead pitch.