With the rapid development of electronic technology, electronic products have become more and more powerful and small in size, but this is the cost of electronic components that are electrostatically sensitive. This is because high integration means that the circuit unit will be narrower and the tolerance of the electrostatic discharge capability is getting worse and worse. In addition to a large number of new materials, special devices are also static sensitive materials, so that electronic components, especially semiconductor devices, are SMT proofing, trial production, processing production, assembly and maintenance environment static control requirements are getting higher and higher.SMT Proofing Trial ProductionThe flux is usually matched with the solder during SMT processing. It should be based on the solder alloy, different process methods and component pins, PCB pad coating materials, metal surface oxidation degree, and the product's cleanliness and electrical performance. Specific requirements to choose.
SMT proofing, trial production, dip soldering, wave soldering, and other soldering processes. General principles for selecting fluxes
Under normal circumstances, electronic products such as satellites, aircraft instruments, submarine communications, life-protecting medical devices, and weak signal test equipment must be used for military and life support electronic products such as cleaning flux.
No-clean or clean-type flux can be used for electronic products of communication, industry, office, computer and other types.
General consumer electronic products can use no-clean flux, or use RMA rosin type, without cleaning.
The principle of selecting flux for manual soldering of circuit boards and rework
①Be sure to choose the same type of SMT processing flux used for reflow soldering and wave soldering.
② Especially for smt chip processing and assembly circuit boards with high reliability requirements, the flux must be strictly controlled.
The SMT proofing trial production process mainly includes several important processes such as solder paste printing, 3D-SPI solder paste thickness inspection, part placement, reflow soldering, AOI optical inspection, and maintenance. Strict and precise execution of each process is the prerequisite to ensure product quality.
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