Application interpretation of R&D model patch
- 2020-01-30-

With the advancement of science and technology and the requirements of the process, the components on the circuit board also require less and less space, and the higher the efficiency. Therefore, the chip components (no leads or short lead surface mount components) have been developed. These components The device occupies a small space, and the efficiency of SMT placement with a placement machine is very high, and the problems are getting smaller and smaller. This is a manifestation of scientific and technological progress. R&D model placement refers to processing on the basis of PCB The series process flow, also known as printed circuit boards and printed circuit boards, is an important electronic component, a support for electronic components, and a provider of electrical connections for electronic components. Because it is made by electronic printing, it is called a "printed" circuit board.

Since the R&D model patch is made by electronic printing, SMT is a surface assembly technology, which is a popular technology and process in the electronic assembly industry. Electronic circuit surface assembly technology is called surface mount or surface mount technology.


It is a circuit assembly technology in which no-lead or short-lead surface assembly components are mounted on the surface of a printed circuit board or other substrates, and then welded and assembled by methods such as reflow soldering or dip soldering. Under normal circumstances, the electronic products we use are designed by pcb plus various capacitors, resistors and other electronic components according to the designed circuit diagram, so all kinds of electrical appliances need a variety of smt chip processing techniques to process.

The basic process components of R&D model placement: solder paste printing-GG gt; parts placement-GG gt; reflow soldering-GG gt; AOI optical inspection-GG gt; maintenance-GG gt; sub-board.

The advantages of the R&D model patch: electronic products have a series of advantages such as small size, high assembly density, light weight, high reliability, and strong vibration resistance.

The R&D model patch technology has high assembly density, small size and light weight of electronic products. The volume and weight of patch components are only about 1/10 of that of traditional plug-in components. Generally, after SMT is adopted, the volume of electronic products is reduced by 40% to 60%. , The weight is reduced by 60%~80%. High reliability and strong anti-vibration ability. The defect rate of solder joints is low. Good high frequency characteristics. Reduce electromagnetic and radio frequency interference. It is easy to realize automation and improve production efficiency. Reduce costs by 30%~50%. Save materials, energy, equipment, manpower, time, etc.